Department of Electrical, Electronic, and Communication Engineering,
Faculty of Science and Engineering, Chuo University
Graduate School of Science and Engineering, Chuo University

2019 2018 2017 2016 2015 2014 2013 2012 2011
2010 2009 2008
May17-20,15 Publications:
  • Senju Yamazaki, Shuhei Tanakamaru, Sakuya Suzuki, Tomoko Ogura Iwasaki, Shogo Hachiya and Ken Takeuchi
    “Reliability Enhancement of 1Xnm TLC for Cold Flash and Millennium Memories;
    Symposium on VLSI Technology and Circuits
  • Atsutake Kosuge, Junki Hashiba, Toru Kawajiri, So Hasegawa, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda and Ken Takeuchi
    “Inductively-Powered Wireless Solid-State Drive (SSD) System with Merged Error Correction of High-Speed Non-Contact Data Links and NAND Flash Memory”
    Symposium on VLSI Technology and Circuits
  • Shuhei Tanakamaru, Hiroki Yamazawa and Ken Takeuchi
    “Privacy-Protection Solid-State Storage (PP-SSS) System: Automatic Lifetime Management of Internet-Data's Right to be Forgotten”
    Symposium on VLSI Technology and Circuits
  • H. Takishita, S. Ning, and K. Takeuchi
    “Trade-off of Performance, Reliability and Cost of SCM/NAND Flash Hybrid SSD”
    Silicon Nanoelectronics Workshop 2015(SNW)
  • May17-20,15 Publications:
  • Tomoko Ogura Iwasaki, Sheyang Ning, Hiroki Yamazawa, Chao Sun, Shuhei Tanakamaru and Ken Takeuchi
    “Machine Learning Prediction for 13x Endurance Enhancement in ReRAM SSD System”
    International Memory Workshop (IMW)
  • Chihiro Matsui, Asuka Arakawa, Chao Sun, Tomoko Ogura Iwasaki and Ken Takeuchi
    “3x Faster Speed Solid-State Drive with a Write Order based Garbage Collection Scheme”
    International Memory Workshop (IMW)
  • Shun Okamoto, Chao Sun, Shogo Hachiya, Tomoaki Yamada, Yusuke Saito, Tomoko Ogura Iwasaki and Ken Takeuchi
    “Application Driven SCM&NAND Flash Hybrid SSD Design for Data-Centric Computing System”
    International Memory Workshop (IMW)
  • Apr14-17,15 Publications:
  • Takahiro Onagi, Chao Sun and Ken Takeuchi
    “Impact of Through-Silicon Via Technology on Energy Consumption of 3D-Integrated Solid-State Drive Systems”
    International Conference on Electronics Packaging (ICEP)
  • Apr1,15 Member list renewal

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